TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
The TIF100-25-11S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 2.5W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> RoHS compliant
Applications:
>CPU
>display card
>mainboard/mother board
>notebook
>power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
>Automotive electronics
>Set top boxes
>Audio and video components
| Typical Properties of TIF100-25-11S Series |
| Color | Gray | Visual | Composite Thickness | hermalImpedance
@10psi
(℃-in²/W) |
| Construction &
Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.48 |
| 20mils / 0.508 mm | 0.56 |
| Specific Gravity | 2.50 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.71 |
| 40mils / 1.016 mm | 0.80 |
| Heat Capacity | 1 l/g-K | ASTM C351 | 50mils / 1.270 mm | 0.91 |
| 60mils / 1.524 mm | 0.94 |
| Hardness | 40 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 1.05 |
| 80mils / 2.032 mm | 1.15 |
| Tensile Strength | 40 psi | ASTM D412 | 90mils / 2.286 mm | 1.25 |
| 100mils / 2.540 mm | 1.34 |
| Continuos Use Temp | -50 to 200℃ | *** | 110mils / 2.794 mm | 1.43 |
| 120mils / 3.048 mm | 1.52 |
| Dielectric Breakdown Voltage | >10000 VAC | ASTM D149 | 130mils / 3.302mm | 1.63 |
| 140mils / 3.556 mm | 1.71 |
| Dielectric Constant | 7.5 MHz | ASTM D150 | 150mils / 3.810 mm | 1.81 |
| 160mils / 4.064 mm | 1.89 |
| Volume Resistivity | 7.8X10" Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.98 |
| 180mils / 4.572 mm | 2.07 |
| Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 2.14 |
| 200mils / 5.080 mm | 2.22 |
| Thermal conductivity | 2.5 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Product Tags:
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TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules Images
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